PCB is an acronym for printed circuit board. It is a board that has lines and pads that connect various points together. In the picture above, there are traces that electrically connect the various connectors and components to each other. A PCB allows signals and power to be routed between physical devices. Solder is the metal that makes the electrical connections between the surface of the PCB and the electronic components. Being metal, solder also serves as a strong mechanical adhesive.
Printed circuit board is the most common name but may also be called “printed wiring boards” or “printed wiring cards”. Before the advent of the PCB circuits were constructed through a laborious process of point-to-point wiring. This led to frequent failures at wire junctions and short circuits when wire insulation began to age and crack.
A significant advance was the development of wire wrapping, where a small gauge wire is literally wrapped around a post at each connection point, creating a gas-tight connection which is highly durable and easily changeable.
As electronics moved from vacuum tubes and relays to silicon and integrated circuits, the size and cost of electronic components began to decrease. Electronics became more prevalent in consumer goods, and the pressure to reduce the size and manufacturing costs of electronic products drove manufacturers to look for better solutions. Thus was born the PCB.
What is the Centrios Circuit Edit System?
The Centrios system is the newest member of the Thermo Scientific portfolio of Circuit Edit solutions, targeting the process nodes most relevant to the dynamic field of wireless-internet-connected devices, where time to market spells the difference between success and failure. The Centrios System enables rapid prototyping and first silicon debug and repair for 14 nm and above design-rule devices as well as advanced front and back side edits using an innovative state-of-the-art simultaneous dual-nozzle gas-delivery system in combination with a broad portfolio of chemistries and the latest focused ion beam technology.
The Centrios system is the newest member of the Thermo Scientific portfolio of Circuit Edit solutions, targeting the process nodes most relevant to the dynamic field of wireless-internet-connected devices, where time to market spells the difference between success and failure. The Centrios System enables rapid prototyping and first silicon debug and repair for 14 nm and above design-rule devices as well as advanced front and back side edits using an innovative state-of-the-art simultaneous dual-nozzle gas-delivery system in combination with a broad portfolio of chemistries and the latest focused ion beam technology.
How our Circuit Edit System meets you needs
With the Centrios system, circuit edit engineers, whether supporting designers or in service labs now have a high-performance circuit-edit solution to ensure availability of working first silicon devices to validate design changes, speed customer evaluations and capture critical time-to-market advantage. All of this without waiting for mask respin. Centrios can also be equipped with an IR microscope, which when coupled with our customized bulk trenching gas injection system and NEXS CAD Navigation SW enables fast, precise large area milling of silicon trenches with high accuracy n-well exposure for advanced backside edits.
Enhanced focused ion beam technology
The Centrios System features the Tomahawk Ion Column, which incorporates the latest developments in ion column design, gas delivery and end-point detection, providing fast, efficient and cost-effective editing. The Centrios System is equipped with a five-axis, ultra-high-resolution piezo electric stage and can be configured with a high-resolution IR microscope to enable unparalleled control and precision for every edit.
With the Centrios system, circuit edit engineers, whether supporting designers or in service labs now have a high-performance circuit-edit solution to ensure availability of working first silicon devices to validate design changes, speed customer evaluations and capture critical time-to-market advantage. All of this without waiting for mask respin. Centrios can also be equipped with an IR microscope, which when coupled with our customized bulk trenching gas injection system and NEXS CAD Navigation SW enables fast, precise large area milling of silicon trenches with high accuracy n-well exposure for advanced backside edits.
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The Centrios System features the Tomahawk Ion Column, which incorporates the latest developments in ion column design, gas delivery and end-point detection, providing fast, efficient and cost-effective editing. The Centrios System is equipped with a five-axis, ultra-high-resolution piezo electric stage and can be configured with a high-resolution IR microscope to enable unparalleled control and precision for every edit.